dor_id: 4110165

506.#.#.a: Público

590.#.#.d: Los artículos enviados a la revista "Journal of Applied Research and Technology", se juzgan por medio de un proceso de revisión por pares

510.0.#.a: Scopus, Directory of Open Access Journals (DOAJ); Sistema Regional de Información en Línea para Revistas Científicas de América Latina, el Caribe, España y Portugal (Latindex); Indice de Revistas Latinoamericanas en Ciencias (Periódica); La Red de Revistas Científicas de América Latina y el Caribe, España y Portugal (Redalyc); Consejo Nacional de Ciencia y Tecnología (CONACyT); Google Scholar Citation

561.#.#.u: https://www.icat.unam.mx/

650.#.4.x: Ingenierías

336.#.#.b: article

336.#.#.3: Artículo de Investigación

336.#.#.a: Artículo

351.#.#.6: https://jart.icat.unam.mx/index.php/jart

351.#.#.b: Journal of Applied Research and Technology

351.#.#.a: Artículos

harvesting_group: RevistasUNAM

270.1.#.p: Revistas UNAM. Dirección General de Publicaciones y Fomento Editorial, UNAM en revistas@unam.mx

590.#.#.c: Open Journal Systems (OJS)

270.#.#.d: MX

270.1.#.d: México

590.#.#.b: Concentrador

883.#.#.u: https://revistas.unam.mx/catalogo/

883.#.#.a: Revistas UNAM

590.#.#.a: Coordinación de Difusión Cultural

883.#.#.1: https://www.publicaciones.unam.mx/

883.#.#.q: Dirección General de Publicaciones y Fomento Editorial

850.#.#.a: Universidad Nacional Autónoma de México

856.4.0.u: https://jart.icat.unam.mx/index.php/jart/article/view/715/683

100.1.#.a: Mansoor, Muhammad Mansoor; Zilohu, Ahnaf Usman; Mujahid, Muhammad; Khan, Shaheed

524.#.#.a: Mansoor, Muhammad Mansoor, et al. (2018). Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films. Journal of Applied Research and Technology; Vol. 16 Núm. 3. Recuperado de https://repositorio.unam.mx/contenidos/4110165

245.1.0.a: Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films

502.#.#.c: Universidad Nacional Autónoma de México

561.1.#.a: Instituto de Ciencias Aplicadas y Tecnología, UNAM

264.#.0.c: 2018

264.#.1.c: 2019-06-25

653.#.#.a: In-Ag solders; lower soldering temperature; contact angle; spreading factor; scavenging zone; scavenging phase

506.1.#.a: La titularidad de los derechos patrimoniales de esta obra pertenece a las instituciones editoras. Su uso se rige por una licencia Creative Commons BY-NC-SA 4.0 Internacional, https://creativecommons.org/licenses/by-nc-sa/4.0/legalcode.es, para un uso diferente consultar al responsable jurídico del repositorio por medio del correo electrónico gabriel.ascanio@icat.unam.mx

884.#.#.k: https://jart.icat.unam.mx/index.php/jart/article/view/715

001.#.#.#: 074.oai:ojs2.localhost:article/715

041.#.7.h: eng

520.3.#.a: Soldering electrical contacts to gold thin films is a matter of consideration due to high soldering temperature, restricted wetting, excessive scavenging and low strength offered by most of the common soldering alloys. Indium alloys offer certain benefits for gold soldering justifying their increased cost. In the present study, hypo-, hyper- and eutectic In-Ag solder were prepared and investigated for compositional and structural homogeneity, soldering temperature, contact angle, spreading factor, scavenging zone and scavenging phase (i.e. AuIn2). It was found that addition of silver (~3.5%) ameliorated the above mentioned characteristics for better control of soldering practice with gold thin films besides lowering the soldering temperature.

773.1.#.t: Journal of Applied Research and Technology; Vol. 16 Núm. 3

773.1.#.o: https://jart.icat.unam.mx/index.php/jart

022.#.#.a: ISSN electrónico: 2448-6736; ISSN: 1665-6423

310.#.#.a: Bimestral

264.#.1.b: Instituto de Ciencias Aplicadas y Tecnología, UNAM

doi: https://doi.org/10.22201/icat.16656423.2018.16.3.715

harvesting_date: 2023-11-08 13:10:00.0

856.#.0.q: application/pdf

file_creation_date: 2019-11-05 17:39:24.0

file_modification_date: 2019-11-05 17:39:24.0

file_creator: MAE

file_name: 8e50be1532fd0d602ebce89012a6d1cd91dbd9c277e4aee59bae5821f75285d1.pdf

file_pages_number: 9

file_format_version: application/pdf; version=1.5

file_size: 3821897

last_modified: 2024-03-19 14:00:00

license_url: https://creativecommons.org/licenses/by-nc-sa/4.0/legalcode.es

license_type: by-nc-sa

No entro en nada

No entro en nada 2

Artículo

Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films

Mansoor, Muhammad Mansoor; Zilohu, Ahnaf Usman; Mujahid, Muhammad; Khan, Shaheed

Instituto de Ciencias Aplicadas y Tecnología, UNAM, publicado en Journal of Applied Research and Technology, y cosechado de Revistas UNAM

Licencia de uso

Procedencia del contenido

Cita

Mansoor, Muhammad Mansoor, et al. (2018). Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films. Journal of Applied Research and Technology; Vol. 16 Núm. 3. Recuperado de https://repositorio.unam.mx/contenidos/4110165

Descripción del recurso

Autor(es)
Mansoor, Muhammad Mansoor; Zilohu, Ahnaf Usman; Mujahid, Muhammad; Khan, Shaheed
Tipo
Artículo de Investigación
Área del conocimiento
Ingenierías
Título
Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films
Fecha
2019-06-25
Resumen
Soldering electrical contacts to gold thin films is a matter of consideration due to high soldering temperature, restricted wetting, excessive scavenging and low strength offered by most of the common soldering alloys. Indium alloys offer certain benefits for gold soldering justifying their increased cost. In the present study, hypo-, hyper- and eutectic In-Ag solder were prepared and investigated for compositional and structural homogeneity, soldering temperature, contact angle, spreading factor, scavenging zone and scavenging phase (i.e. AuIn2). It was found that addition of silver (~3.5%) ameliorated the above mentioned characteristics for better control of soldering practice with gold thin films besides lowering the soldering temperature.
Tema
In-Ag solders; lower soldering temperature; contact angle; spreading factor; scavenging zone; scavenging phase
Idioma
eng
ISSN
ISSN electrónico: 2448-6736; ISSN: 1665-6423

Enlaces